This Series
is oriented toward quality assurance, process optimization, failure
analysis and material development in the areas of polymers, foods and
pharmaceuticals.
Differential
Scanning Calorimeter (DSC 200 F3 Maia®)
(-150...600°C)
Quantities/Properties measured:
Glass transition, melting, crystallization,
reaction behavior, stability, OIT;
Differential Scanning Calorimeter (DSC 204
F1 Phoenix®)
(-180...700°C)
Quantities/Properties
measured:
Glass transition, melting, crystallization,
reaction behavior, stability, OIT;
polymorphism, compatibility, purity
High-Pressure-DSC
(DSC 204 HP Phoenix®)
Quantities/Properties
measured:
Dependence on thermal properties at defined pressures and
atmospheres
Thermogravimetric Analyzer (TG 209 F1 Iris)
Quantities/Properties measured:
Thermal stability; composition: content of
polymers, additives, fillers, moisture and solvents;
dehydration, decarboxylation
 Thermogravimetric
Analyzer (TG 209 F3 Tarsus)
Quantities/Properties measured:
Thermal stability; composition: content of
polymers, additives, fillers, moisture and solvents;
dehydration, decarboxylation
Thermomechanical Analyzer (TMA 202)
Quantities/Properties measured:
Coefficient of thermal expansion; expansion, shrinkage,
softening and penetration behavior
Dynamic Mechanical Analyzer (DMA 242)
Quantities/Properties measured:
Viscoelastic properties; stiffness and
damping behavior; glass transition,
secondary transition, cross-linking
Combined (Hyphenated)
Techniques (TG-MS, TG-FTIR)
TG 209-QMS Capillary (RT...1000°C)
TG 209-FTIR (RT...1000°C)
Quantities/Properties measured:
Evolved gases
Pulse
Thermal Analysis PTA®
Quantities/Properties measured:
Quantification of MS and FTIR signals
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200
Series • 400 Series • Advanced
Software • Contract Testing
Thermal Conductivity/Diffusivity Series • Dielectric
Analyzers
The 400
Series is designed primarily for high-temperature applications in the
thermal analysis of ceramics, minerals, metals, polymer composites,
etc. and the determination of thermophysical properties. There are also
a number of special instruments included in this series.
Dilatometer (DIL 402 C)
Quantities/Properties measured:
Thermal expansion of solids and, in some cases, liquids
Dilatometer (DIL 402 PC)
Quantities/Properties measured:
Thermal expansion of solids and, in some cases, liquids and softening behavior
Dilatometer (DIL 402 CD)
Dual-Sample & Diiferential-style measurements
Quantities/Properties
measured:
Thermal expansion of solids and, in some cases, liquids and
softening behavior
Special Dilatometer (DIL 402
E)
(-260...2800°C)
Quantities/Properties measured:
Thermal expansion of solids and, in some cases, liquids
Differential Scanning Calorimeter (DSC 404
C Pegasus®)
Quantities/Properties measured:
Phase transitions (glass transition, melting, crystallization),
reaction behavior,
oxidative stability, polymorphism, compatibility, purity
Simultaneous
Thermal Analyzer (STA 409 PC Luxx¨)
(RT...1550°C)
Combines Differential Scanning Calorimetry (DSC) or Differential Thermal
Analysis (DTA) with Thermogravimetry (TG)
Simultaneous
Thermal Analyzer (STA 449 C Jupiter®)
Combines
Differential Thermal Analysis (DTA) or Differential Scanning Calorimetry
(DSC) with Thermogravimetry (TG)
STA 409-PC Luxx®
Combined
(Hyphenated) Techniques (TG-MS, TG-FTIR)
STA 409-QMS Skimmer (RT...2000°C)
STA 409-QMS Capillary (RT...2000°C)
STA 409-FTIR (RT...2000°C)
STA 449 C
Jupiter®-QMS
Capillary (RT...1650°C)
STA 449 C Jupiter®-FTIR (RT...1650°C)
STA
409 PC Luxx¨-
QMS Capillary (RT...1550°C)
STA 409 PC Luxx¨-
FTIR (RT...1550°C)
Quantities/Properties measured:
Evolved gases
Pulse
Thermal Analysis PTA®
Quantities/Properties measured:
Quantification of MS and FTIR signals
Laser
Flash Apparatus (LFA 427)
Quantities/Properties measured:
Thermal diffusivity
LFA
447 Nanoflash®
Quantities/Properties measured:
Thermal diffusivity, specific heat, thermal conductivity (RT...300°C)
LFA
457 Microflash: -125C to +1100C
Heat
Flow Meters
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Series • 400 Series • Advanced
Software • Contract
Testing
Thermal Conductivity/Diffusivity Series • Dielectric
Analyzers
Under
the name Advanced
Software are found a series of integrated programs:
 Thermokinetics
ChemRheo
Thermal
Simulations
Peak Separation
Purity Determination
Density
Determination
DSC/DTA
Corrections
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200
Series • 400 Series • Advanced
Software • Contract
Testing
Thermal Conductivity/Diffusivity Series • Dielectric
Analyzers
Netzsch offers a full line of instruments to test a wide
range of materials. Instruments test in accordance with established
ASTM and ISO procedures. Automation is available on most all instruments,
as well as internal microprocessor control on selected models. Installation,
service and training is available worldwide.
Insulations
and Low Conductivity Materials
Heat
Flow Meters
Heat flow meters are typically used to test foam, fiberglass or fill
insulations used in building and home applications as well as some
structural materials and moisture barrier material.
Guarded Hot Plate
The Guarded Hot Plate allows determination of the thermal conductivity of insulation materials with outstanding reliability and accuracy under high vacuum conditions. Large samples 30cm x 30cm and up to 10cm in thickness can analyzed between -160 and 700°C.
Engineering
and Medium/High Conductivity Materials
Flash
Diffusivity Instruments - Laser & Xenon
Flash diffusivity instruments, both laser and xenon, offer the advantages
of rapid testing and wide utility over a broad range of material
thermal conductivities. Materials suited to flash testing include
composites, alloys, ceramics, coatings and plastics.
Specific
Heat
Flash Diffusivity Instruments - Laser & Xenon
NETZSCH flash diffusivity instruments offer the powerful
additional capability to measure the specific heat of a
material, eliminating
the need for a separate calorimetry measurement.
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Series • 400 Series • Advanced
Software • Contract
Testing
Thermal Conductivity/Diffusivity Series • Dielectric
Analyzers
The Epsilon Series of Dielectric Analyzers (originally
developed under the Micromet name) is the leading line of in-process
cure monitoring instrumentation for the thermosetting polymer processing
industry. Over 500 Epsilon Series and Micromet dielectric cure monitoring
systems are used worldwide in R&D, QA/QC, process monitoring
and process control applications involving thermosetting resins,
composites, paints, and coatings.
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